Electrostatic Chuck Optimizer

  • Product No:Model 646
  • Manufacturer:Trek, Inc.

Trek’s Model 646 software-driven Electrostatic Chuck Supply offers an array of features that provide significant benefits while accommodating a variety of demanding applications.  Documented use shows that customers have seen increases in efficiency and throughput equal to three times that of other supplies. Additionally, the Model 645 virtually eliminates sticky wafer and wafer popping issues, thus ensuring better control over particle contamination. 


Given the versatility and performance of the Model 646,  it can be used in multiple unique tools/processes, thus eliminating the need to specify a new supply for each unique tool/process in a facility.


Typical Applications Include 

  • Electrostatic-driven handling of materials 

  • Semiconductor wafer processing 

  • Non-mechanical transfer of flat panels or other processing materials sensitive to mechanical clipping


Features and Benefits 

  • Supports both Coulombic and Johnsen-Rahbek ESC technologies 

  • User configurable for custom clamp and declamp sequences and wave shapes 

  • Electrostatic chuck profiles can be uploaded to the unit and stored internally via a user-friendly software interface 

  • Documented reduction of backside gas errors, increased throughput, and elimination of sticky/popping wafers 

  • Lockable front panel control interface 

  • Ability to control parameters such as over-current, wafer-present and wafer-clamped thresholds, clamp voltage, offset voltage and internal or external amplitude/offset control 

  • Wafer detection includes no wafer, wafer present or wafer clamped status 

  • Includes in-process-adjustable amplitude/offset and output-control versatility 

  • Output can be controlled by back panel I/O, serial computer command or front panel controls 

  • NIST-traceable Certificate of Calibration provided with each unit 

  • CE Compliant


Outputs

Simultaneous HighVoltage Outputs:Two simultaneous high-voltage outputs (Output Phase A and Output Phase B) of equal magnitude                                                                     and opposite in polarity relative to an offset voltage

Output Phasing 

Output Voltage A   (Reference Phase): 0 to ±3 kV

Output Voltage B: 0 to ±3 kV (Phase B =[-1] x Phase A)  


Offset Voltage  (This feature can  be disabled through  the program):

Each DC output voltage (Phase A and Phase B) is ramped up and down with symmetrical rise and fall times, or they can be programmed with the user's custom clamping and declamping waveforms.  The clamping process is initiated in response to the Clamp On/Off control.  The polarity of each output reverses to the opposite polarity after each Clamp On/Off cycle. 


Output Waveshape: 

Each DC output voltage (Phase A and Phase B) is ramped up and down with symmetrical rise and fall times, or can be programmed with the user’s custom clamping and declamping waveforms 


Output Voltage Range: 0 to ±3 kV DC, maximum 

Output Current: 0 to ±6.5 mA DC with peak capability of 10 mA


Input

Setting the HighVoltage Amplitude:  HV magnitude can be controlled either externally or internally to the unit

Setting the Offset Voltage:  Offset voltage may be controlled externally or internally to the unit


Output Voltage Monitor (Back Panel Connector) 

Scale Factor : 1 V/300 V 

Phase B DC:  Accuracy better than 0.5% of full scale

Offset Voltage: Less than 10 mV 

Output Noise: Less than 50 mV rms*


Steady State Voltage Leakage Current Monitor

Scale Factor:  1V / 1 µA 

DC Accuracy: ± 0.1 µA 

Output Noise: Less than 50 mV rms* 


Features 

Interlock: Connections are provided to support an interlock safety configuration. In the event that the interlock is open, the high-voltage generation circuits are shut down


Digital Display: 40X2 LCD character display shows various system functions such as Set Voltage, Output Voltage and Capacitance Monitor 


Clamped Wafer Detection Feature (Thresholds are set by the program) :

To indicate wafer clamping events, the capacitive currents generated by a low voltage sine wave, super-imposed on the Phase A and Phase B outputs, are monitored but can be disabled through the program. The superimposed waveform is used to indicate a no wafer, wafer present or wafer clamped status


Capacitive Load Select:

Clamped capacitance status range can be selected by the program for 0 to 10, 20 or 30nF (phase to phase) depending on the system and electrostatic clamp physical configurations


Mechanical

Dimensions:88.1 mm H x 431.8 mm W x 531.9 mm D (3.47” H x 17” W x 20.9” D) 1U rack enclosure

Panel Width:482.6 mm (19”)

Weight: 8.5 lbs (3.86 kg) 

Connectors: 15-pin “D” ITT Canon used by remote device to control/monitor the unit, 9-pin “D” ITT Canon RS232, 3-Pin FCT “D” High-Voltage, standard type-A USB, Ethernet (optional) and Front Panel 

Power ON/OFF: 2-position rocker switch


Operating Conditions 

Temperature: 0°C to 35°C (32°F to 104°F)

Relative Humidity:To 85%, noncondensing 

Altitude: To 2000 meters (6561.68 ft.) 


Electrical DC Input Receptacle:

2.0 mm locking DC jack; center contact is positive and shell is negative (receptacle mates with Switchcraft S761K plug) 

Ground Receptacle: Ground stud 

Power Requirements: 24 V DC, 2.0 A 


Supplied Accessories

Operator Manual, SW  PN: 24013

USB Cable HV Connectors PN: BA103 PN: B8076R

DC Plug ( S761K) Switchcraft PN: BA119R 

Line Cord, Fuses Selected per geographic destination 


Optional Accessories 

90-264 V AC to  24  V DC Power Adapter:   PN: IK045 


Note

Trek Model 645, a ±2 kV version of this instrument is also available. 

Please contact the factory for more information.