Specifically designed to test the thickness and full-thickness distribution of different films prepared in semiconductor processes, a proprietary NANO algorithm is used to monitor the film characteristics in different processes.The system is compatible with 12-inch semiconductor wafers And conduct a full-chip test.Uses top optical components and leading optical system, to ensure maximum test repeatability and accuracy.With its own CCD video and bias light system, to provide the most suitable for the semiconductor film monitoring.As Nanospec The system is widely used in semiconductor plants and has important standard traceability implications for semiconductor equipment manufacturers and foundries
Spectral range 200nm - 800nm
Film thickness test range 35Å-20um
Spot size 14um
Film thickness test dynamic repeatability
3.5-10nm <1Å
10nm-100nm <0.8Å
100 nm-500 nm <0.08%
500nm-20um <0.05%
Film thickness test accuracy
100-200Å ± 5Å
300Å-1um ± 0.5%
1um-20um ± 0.2%
Reflectivity accuracy
248nm ± 0.5%
365nm ± 0.5%
633nm ± 0.5%