The OAI Model 200 Mask Aligner is a cost-effective high performance mask Aligner that has been engineered with industry proven components that have made OAI a leader in the photolithography capital equipment industry. The Model 200 is a bench top mask Aligner that requires minimal cleanroom space. It offers an economic alternative for R&D, or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The system is capable of one micron resolution and alignment precision.
The alignment module features mask insert sets and quick-change wafer chucks that facilitate the use of a variety of substrates and masks without requiring special tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and Z-axis.
The Model 200 Mask Aligner features a dependable OAI UV light source which provides collimated UV light in Near or Deep UV using lamps ranging in power from 200 to 2000 watts. Dual-sensor, optical feedback loops are linked to the constant intensity controller to provide control of exposure intensity within ±2% of the desired intensity. Changes may be made to the UV wavelength quickly and easily. This mask Aligner is a flexible, economic solution for any entry-level mask alignment and UV exposure application.
Requires minimal clean room space
Causes minimal damage to fragile substrate materials
Accurate alignments to 1 micron
Easily accommodates a wide variety of substrates and masks
Backside mask alignment of IR transparent wafers with accuracy up to 3-5 microns
Highly collimated, uniform UV light
Quickly change the UV light wavelength
Exposure controlled intensity to ±2%
Can be configured as a Nano Imprint tool for NIL
Can be configured with a Microfluidics Module