The PegasusTM A200 series offers dual-end, parallel processing of wafers which optimizes wafer handling for maximum throughput.
Designed for easy access when manually loading and unloading wafers the PegasusTM A200 has a capacity of two cassettes, each containing 25 wafers.
Featuring a highly advanced, single-stage wafer detection pre-alignment and transportation system, the PegasusTM A200 ensures long-term accuracy and repeatability.
The PegasusTM A200 Series probers deliver menu-driven, push button control via proprietary LabMaster™ control and monitoring software.
An extensive range of control and monitoring parameters enable users to operate PegasusTM A200 Series probers at peak performance, including: realtime monitoring and test setup; yield analysis of both the wafer and batch under test; premium mapping capability; image analysis, and a host of other advanced features.
Configurable to voltages in excess of 5 kV for specialized applications Optional thermal chuck capability.
High throughput cassette to cassette automation.
Automatic wafer handling, pattern recognition and wafer probing.
Wafer pre-alignment and wafer detection.
Many automation options.
Customizable product enhancing hardware and software options.
Performance thermal chuck solutions.
Wide range of product enhancing accessories.
Robust mechanical design.
PROBER
XY STAGE Type :High precision re-circulating ball screws
Stage Travel: 210 mm x 210mm (8.3” X 8.3”)
Resolution: 1.25 μm
Accuracy: ± 7 μm over 200mm
Repeatability ± 4 μm
XY Speed: Up to 100 mm/s
Automatic Alignment Repeatability: ± 5 μm
WAFER HANDLER
ROBOT Speed :1270 mm/s (R), 254 mm/s (Z), 800 º/s (Ø)
Positional Repeatability :12.7 μm (Z), 38.1 μm (R)0.01°(Ø) at constant
temperature Flat Orientation Selectable
Pre-Alignment Accuracy :± 63.5 μm ± 0.125º
Repeatability: ± 4 μm
XY Speed: Up to 100 mm/s