Extending the range and performance of the industry proven NanoSpec 6100, the NanoSpec II introduces a new design with automated sample alignment, fast autofocus, sub 1-second per site measurement time and measurement repeatability better than 1Å. For existing 6100 customers, the NanoSpec II will offer an intuitive recipe transfer system, offering full backward compatibility of all measurement recipes. The system can be incorporated with Nanometrics’ powerful NanoDiffract® spectroscopic reflectivity analysis software, image processing for automated pattern alignment and an optional robotic 200mm wafer handling system, making the NanoSpec II the most powerful thin film system in its class.
Standard Features
• Wafer Sizes: 50mm – 200mm
• Stage Control – multiple mouse click options,fully automatic recipe control
• Industrial PC / Windows 7 OS
• Flat panel Monitor
• Operations manual (CD)
• FFT thickness analysis Algorithm
• NanoDiffract® SR analysis with full stack multiple layers and optical constants variation monitoring
• Image Based Processing for automated patterned wafer alignment
• Fully automated wafer handling with up to 3 cassette station
Optional Features
• NanoStandard® film thickness standard wafer
• SECS/GEM automation interface
• NanoDiffract® SR offline analysis station
• Cleanroom operations manual (hard copy)
| DUV1 | VIS/NIR2 | Thick Film2 |
Specification | |||
Spectral range | 200-800nm | 450nm-1050nm | 500nm-800nm |
Thickness range | 35Å-20μm | 100nm-30μm | 500nm-120μm |
Spot size options | 7μm/14μm | 20μm/40μm | 20μm/40μm |
Dynamic Repeatability/Stability (1-sigma)4,5,6 | |||
3.5-10nm | <1.00Å | - | - |
10nm-100nm | <0.80Å | - | - |
100nm - 500nm | <0.08% | <0.10% | - |
500nm - 20μm | <0.05% | <0.10% | <0.05% |
20μm - 30μm | - | <0.10% | <0.05% |
30μm - 120μm | - | - | <0.05% |
Applications | |||
Typical use cases | NO & ONO, gate oxides, low k & high k, ultra thin films | aSi, pSi, thin EPI, thick oxides | resist, very thick oxides, organic materials |
Typical users | R&D, FEOL production | substrate manufacturing, MEMS | Litho, MEMS, bio/organics R&D |
Throughput9 | 5pt | 9pt | 13pt |
Typical Throughput | 80 wph | 55 wph | 39 wph |
Sample Applications
R&D | High-k dielectrics development | The Nanospec II allows monitoring of n&k values using a large variety of dispersion models. This is ideal for fast & easy process setup or R&D work |
low-k dielectrics development | ||
Thin metal & alloy’s | ||
LED
| Buffer layer thickness such as ZnO, CdS | A large group of applications people with specialized knowledge to an industry are able to characterize and setup material files for advanced materials |
Filter Layer stacks | Nanometrics advanced modelling engine allows stable and fast multi-layer measurements and various options for lookup models and BEMA models | |
Solar | CdS layer | Thickness & n&k changes can be tracked safely. Recipes can be transferred to the TSM inline solar monitor |
ZnO, SiNx, SiO2 | Buffer layer monitoring and recipe exchange to the TSM inline solar monitor | |
Dielectrica such as SiO2, SiNx | The Nanospec II allows monitoring of n&k values using a large variety of dispersion models. This is ideal for fast & easy process setup or R&D work | |
MEMS / substrates | aSi/pSi | Amorphous/Polycrystalline Si, enriched Si layers |
Resist/thick films | Thick Oxide layers, large thickness resist layers | |
Rough layers | Roughness on multilayer or single layer stacks |